Defect Engineering in Multilayer H-Bn Based RRAM by Localized Helium Ion Irradiation

Two-dimensional (2D) layered dielectrics have recently emerged as the attractive building blocks for the next-generation resistive random-access memory (RRAM). The ability to tailor conductive filament (CF) via site-selective defect engineering is essential for realizing controlled resistive switching property. We demonstrated hexagonal boron nitride ( h -BN) based RRAM with controlled defect engineering via Helium ion (He + ) beam implantation, which leads to controllable CF regardless of the thickness of h-BN. The simulation results show that controllable defect paths can be achieved in h-BN by controlling the dose of helium ions. By applying different compliance currents, the He + implanted h -BN based devices exhibit the same set voltage, demonstrating the establishment and operation of a single filament. The nanoscale conductive-filament-engineering contributes to the superb performance of h-BN RRAM devices with ultra-low sub-pW standby power and a large on/off ratio of 10 8 . Non-volatile resistive switching with data retention behavior is also demonstrated. Our work provides a manufacturing strategy with defect engineering in 2D material for realizing high-performance non-volatile RRAM.