The Transcription Factor OsSPL9 Endows Rice with Copper Deficiency Resilience

JOURNAL OF EXPERIMENTAL BOTANY(2024)

引用 0|浏览9
摘要
Copper (Cu) is a crucial micronutrient essential for the growth and development of plants. Rice exhibits remarkable resistance to Cu deficiency, but the underlying molecular mechanisms are not well understood. In this study, we reveal that the plant's ability to withstand Cu deficiency is orchestrated by a transcription factor known as OsSPL9. We have demonstrated that OsSPL9 functions as a central regulator of Cu homeostasis. Disrupting OsSPL9 through knockout significantly reduces the plant's tolerance to Cu deficiency. As a result, the spl9 mutants exhibit reduced Cu accumulation in their shoots when compared to wild-type plants. This reduction is linked to a disruption in the transport of Cu from older leaves to younger ones. Furthermore, we show that OsSPL9 directly binds to GTAC motifs in the promoters of key genes involved in Cu uptake and transport, as well as Cu-miRNAs, and enhances their transcription under Cu-deficient conditions. Overall, our findings shed light on the molecular basis of rice resilience to Cu deficiency stress and place the transcription factor OsSPL9 as a master regulator of this response.
更多
查看译文
关键词
Copper deficiency,Cu transport,GTAC motif,rice,spl9 mutant,transcription factor
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
0
您的评分 :

暂无评分

数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn