Thickness‐Dependent Heat Dissipation in CrOCl Heat‐Escaping Channel

AbstractWith the continuous miniaturization, integration, and stacking of chips, how to effectively dissipate heat at nanoscale has become a pressing challenge. The previous studies toward heat dissipation are only limited to a few materials, and lacking research on practical design and application. In this work, it is found that the novel antiferromagnetic insulator CrOCl can be well applied to the nanoscale heat dissipation, where a high out‐of‐plane thermal conductivity up to 1 W m−1 K−1, and a high interfacial thermal conductance up to 100 MW m−2 K−1 with SiO2/Si substrate are measured. Moreover, it is found that the thicker channel shows a superior heat‐escaping performance, and the thickness proves to be a key factor in the design of high‐performance heat dissipation, rather than simply considering the thermal transport properties of the channel. This work provides new insights for the design of the heat‐escaping channel by proposing a new heat dissipation material at nanoscale.