Taein Shin - School of Electrical Engineering, Korea Advanced Institute of Science and Technology

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个人简介

Taein Shin received the B.S. degree in mechanical engineering from the Gwangju Institute of Science and Technology (GIST), Gwangju, South Korea, in 2018, and the M.S. degree in electrical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2020, where he is currently pursuing the Ph.D. degree. His current research interests include the analysis of neuromorphic system considering signal integrity (SI) and machine learning-based I/O interface design for system-level power supply noise induced jitter (PSIJ) reduction.

研究兴趣

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Design and Analysis of Ultra High Bandwidth (UHB) Interconnection-based GPU-Ring for the AI Superchip Module

Jungmin Ahn,Seonguk Choi,Taein Shin, Junghyun Lee,Jiwon Yoon,Keunwoo Kim,Keeyoung Son, Haeseok Suh, Taesoo Kim, Hyunah Park, Hyunjun An,Jinwook Song,

2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)

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Design and Analysis of L3 Cache Embedded-GPU-High Bandwidth Memory Architecture with Reduced Energy and Latency for AI Computing

Haeseok Suh,Jiwon Yoon,Keeyoung Son,Seonguk Choi,Keunwoo Kim,Junghyun Lee,Taein Shin, Hyunjun An,Taesoo Kim, Jungmin Ahn, Hyunah Park,Hyunsik Kim,

2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)

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Imitation Learning-based Fast Optimization of SSD Interface for PCIe 6.0 Considering Signal Integrity

Seonguk Choi,Jihun Kim,Taein Shin, Jungmin Ahn,Keunwoo Kim,Keeyoung Son,Joonsang Park,Jinwook Song, Kyungsuk Kim,Sunghoon Chun,Joungho Kim

2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)pp.1-6, (2024)

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Explainable Reinforcement Learning(XRL)-Based Decap Placement Optimization for High Bandwidth Memory (HBM)

Keunwoo Kim,Hyunwook Park,Keeyoung Son,Seonguk Choi,Taein Shin, Junghyun Lee,Jiwon Yoon, Hyunjun An,Haeyeon Kim,Wooshin Choi, Jung-Hwan Choi,Joungho Kim

2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)

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Pin-opt: Graph Representation Learning for Large-scale Pin Assignment Optimization of Microbumps Considering Signal and Power Integrity

Joonsang Park,Seonguk Choi,Keeyoung Son,Junghyun Lee,Taein Shin,Keunwoo Kim,Boogyo Sim,Seongguk Kim,Jihun Kim,Jiwon Yoon,Youngwoo Kim,Joungho Kim

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 4 (2024): 681-692

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Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity

Keunwoo Kim,Hyunwook Park,Seongguk Kim,Youngwoo Kim,Kyungjune Son,Daehwan Lho,Keeyoung Son,Taein Shin,Boogyo Sim,Joonsang Park,Shinyoung Park,Joungho Kim

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269

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Design and Analysis of Extended Scale Cache (ESC) Stacked-GPU-HBM Module Architecture Considering Power Integrity (PI)

Hyunah Park,Seonguk Choi,Haeyeon Kim,Taein Shin,Keeyoung Son,Jiwon Yoon,Junghyun Lee, Haeseok Suh,Taesoo Kim, Jungmin Ahn, Hyunjun An,Joungho Kim

2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)

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PSIJ Based Optimal PDN Design for Cost-Effective SSD Using Reinforcement Learning

Taein Shin,Seonguk Choi, Jungmin Ahn, Junghyun Lee,Keunwoo Kim, Haeseok Suh, Hyunah Park,Haeyeon Kim, Hyunjun An,Jinwook Song,Joungho Kim

2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)

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Eye-Diagram Edge Estimation (EEE) Network for Through Silicon Via Design in Next-Generation High Bandwidth Memory

Hyunjun An, Junghyun Lee,Keeyoung Son,Seonguk Choi,Taein Shin,Keunwoo Kim,Jiwon Yoon, Taesoo Kim, Jungmin Ahn, Hyunah Park, Haeseok Suh,Joungho Kim

2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)

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Bayesian Optimization Based Fast and Accurate Wireless Power Transfer System Coil Optimization for High Efficiency

Boogyo Sim,Taein Shin,Hyunwook Park,Keeyoung Son,Keunwoo Kim,Daehwan Lho,Hyungmin Kang,Joonsang Park,Haeyeon Kim,Jihun Kim,Seonguk Choi,Joungho Kim

2023 IEEE WIRELESS POWER TECHNOLOGY CONFERENCE AND EXPO, WPTCE (2023)

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